The reliability of every LCD module rests on tiny, precise connections between the driver IC, the flex circuit and the glass panel. Two processes — COG (Chip-on-Glass) and FOG (Film-on-Glass) — make these connections possible.

What Is COG Bonding?

COG bonding attaches the display driver IC directly onto the LCD glass using anisotropic conductive film (ACF). This reduces module thickness and improves signal integrity — essential for compact, high-performance displays.

What Is FOG Bonding?

FOG bonding connects the flexible printed circuit (FPC) to the glass or to the driver IC, routing signals out to your host board. Precise FOG bonding ensures long-term connection stability.

Why Precision Matters

Poor bonding causes flicker, dead lines and early failure. BELIJ operates mature COG/FOG production lines with strict process control and inspection, so every module ships with dependable connections. Contact us for display modules built on proven bonding technology.